ACM ka tiɲɛtigiya hakɛ: 6-Axis Micro-Lagamuli fanga yɔrɔ min be se ka yɛlɛma .
A be baara kɛ ka nanomɛtiri- nivo ka ɲɔgɔndan gɛlɛyaw ɲɛnabɔ minw be sɔrɔ sanfɛ-Kɔrɔbɔli baarakɛyɔrɔw la, ACM ka tilenninya hakɛ Module be di min ɲɔgɔn tɛ yen .6-axis ka latilenni .ultra-mpact pake kɔnɔ. O fɛɛrɛ hakiliman be tɛmɛ laada XY/Z ka sara kan n’a be yɛlɛmani kɔrɔtaninw fara a kan, o b’a to a be se ka kɛ fotonikiw, semikonduktɛri, ani mikro-} baarakɛcogow la yɔrɔ minw na yɔrɔ dafanin tɛ.
Burukɛcogo fɛɛrɛw
✅ 6-DOF ka sara dafanin
Bayɛlɛmani:±2mm ka taga se ±2,5mm planar latilenni ma;Z-Axis Stroke:4mm ka taga se 10mm yɛlɛmani ma;XY Rotasiyɔn (Rz):±3 degere la, a ka kan ka kɛ;Z-Axis Tilt (Rx/Ry):±6 degere ka taga se degere ±2 ma.
✅ Sub{{0}Minɛ ka tiɲɛn .
Akiliw be mɔgɔ kabakoya±0,02mm siɲɛ caaman ka yɔrɔ min be segi ka kɛ .a datugunin kɔ – 5x ka fisa ni lizinibaara sarata ye.
✅ Fanga hakiliman kɔlɔsili
A be to ka kɛ cogo ɲuman na ni .Z-2-20 ka ji bɔyɔrɔ fanga (4N~40N min)ani min be se ka labɛnE-mode fanga hakɛ (40N~750N).
✅ Ultra-Sɛbɛn ani jatebɔ
jateminɛ0,25kg(yɛlɛmani fitinin) ka taga se .6.45kg, min b’a to mɔgɔw be se ka don yɔrɔ la yɔrɔ -} sisitɛmuw ni kobotiw cɛ.
✅ Aw ka sara hakɛ min sɔrɔ .
A be fɛɛn dɔw minɛ ka bɔ .2kgla50kg.
✅ Pneumatique ka baarakɛcogo ɲuman
dɛmɛfiɲɛ min (51~200 L/min)la6 bari baara(3~8 bar yɔrɔ).
✅ Lizini ka kɛlɛbolo
Operasiyɔn min be se ka la a la ka bɔ .degere 5 ka se degere 60 mafunteni bɛɛ.
A be Micro-Sɛbɛn
Floti min be kɔlɔsi
Module be don ka kɛɲɛ ni sariya ye min be baara kɛ ni fiɲɛ ka fanga ye.
01
Multi-Axis Ɲinigali .
Kɛnɛma yeli / taktili sensɔriw be 6-DOF ka ɲɔgɔndanbaliya lɔn.
02
Ladili min be se ka kɛ
Pneumatique actuators be lɔyɔrɔ yɛlɛma .ani orijɛnaxes bɛɛ la ɲɔgɔn fɛ.
03
Nanomɛtiri Lock
High-rigidite b’a to modɛli be yɛlɛma yɔrɔ min na, o be se ka kɛ ni zero yɛlɛmani ye.
04
Aplitikali application scenarios .
Silisiyɔn ka fɔlikanw ani optikali Comm alignment
F fiyɛw ka ɲɔgɔndan min be kɛ ka laser chips/waveguides ɲini min ka kan ka kɛ sub-mikron lɔyɔrɔ ye .nianguruti tilennin (±0,01 degere ).
Semiconuktɛriw ka baarakɛcogo ɲuman .
Die{{0}to}wafer, wafer-wali {{3}wafer bonding, ani flip-chip ɲɔgɔndan yɔrɔ min na yɛlɛmani be kɛ sababu ye ka lakolonw bali.
Micro-Optiki lajɛnba .
Ka lensɛriw, prismew ani filɛrifɛnw labɛn LiDAR ka modɛliw kɔnɔ, AR/VR ka tulolanw, ani kamera minw be ni endoskopi ye ani u be Rx/Ry kɔrɔfɔ.
Dɔgɔtɔrɔya minanw lajɛli lajɛnba .
Ka mikoro-fluidi kɔnɔfɛnw, opereli minanw ladili, ani ka sub{1}}seliliw don minw be 6-DOF ka tiɲɛtigiya ɲini.
High-Dɔnnikɛli Ɛlɛktɔrɔniki .
Fine- PCB-to- ɲɔgɔndan walima flex-seari 2/{3}}cilaki ɲɔgɔndan sanni / yɛlɛmani / reflow.
Cobot- Mikro{1}}Sɛbɛnni .
Fanga -sili 6-axis be sariya labatoli nɔgɔya ka ɲɛsin yɔrɔ nɔgɔman ma min be tugu ɲɔgɔn kɔ ni datuguli gɛlɛn ye.
Sɛgɛsɛgɛri min be kɛ ni ɔridinatɛri ye (AOI)
Ka kamera lensɛriw wala sɛgɛsɛgɛri kɛcogow labɛn ka ɲɛ, minw be se ka fiɲɛw lɔn ka ɲɛ.
Kantumu ɔridinatɛri ka minanw .
Ka qubit kɔnɔfɛnw sigi sen kan minw be atomu- ka yɔrɔw n’u ka tiɲɛn fɔcogo ɲini.
Kuma laban
ACM ka tilenninya Module be sariya kura dɔ sigi sen kan min be se ka kɛ ka kɛɲɛ ni 6-DOF mikoro-pointing gɛlɛyaw ɲɛnabɔli ye. A ka .sub-micron ka segikanni (±0.02mm), sara min be se ka kɛ (±3 degere Rz, ±6 degere Rx/Ry), fanga kɔlɔsili ɲuman (4~750N), ani ultra{-compact form fa facteur b’a to a nafa ka bon ka se ka kɛ - bɔnsɔn ka fotonikiw la, kantumu minɛnw, semikonduktɛriw ka fɛnw labɛncogo ɲuman, ani mikro{2}}medi lajɛn. Yɔrɔ min na laadalatigɛlaw be yɔrɔ dɔrɔn yɛlɛma, ACM be yɔrɔ lɔnniya dafalen di – ka sɔrɔ hakɛ yɛlɛma baarakɛcogow la minw be suma nanomɛtiriw la ani arc-sekɔniw la.
Tagasogow: acm sarayɔrɔ, Sinuwaw ka acm sarati dilanbagaw, feerekɛlaw, izini .
